|
|
|
|
Multilayer
|
|
The fast development of miniaturization of electronic
components and the reductionof the free spaces have imposed the
birth of the multi-layers circuits.
Alba Elettronica is able to produce multi-layers circuits which
soddisfy the highest tecnological request.
We are also able to produce 20 layers circuits with standard build
up or with particularcustomer's specification concerning control
of impedance.
Multilayer circuits builded high density with Blind or Buried
Via Holes.
Materials:
|
FR4
- |
Standard
Thickness:
|
0,8
- 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm |
Copper Base Thickness:
|
18
- 35 - 70 µm |
Surface Finishing :
|
Sn/PbSurfuso
OSP
HAL
Chemical Gold
Electrolitic Gold
Electrolitic Nickel
Elettrolitic Silver
Grafite
|
|
|
|
|
|
MULTILAYER
WITH STANDARD HOLES |

|
|
MULTILAYER WITH BLIND VIA
HOLES
|
|
|
MULTILAYER
WITH BURIED VIA HOLES |
|