Multilayer

 

The fast development of miniaturization of electronic components and the reductionof the free spaces have imposed the birth of the multi-layers circuits.
Alba Elettronica is able to produce multi-layers circuits which soddisfy the highest tecnological request.
We are also able to produce 20 layers circuits with standard build up or with particularcustomer's specification concerning control of impedance.
Multilayer circuits builded high density with Blind or Buried Via Holes.

Materials:

FR4 -

Standard Thickness:

0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm

Copper Base Thickness:

18 - 35 - 70 µm

Surface Finishing :

Sn/PbSurfuso
OSP
HAL
Chemical Gold
Electrolitic Gold
Electrolitic Nickel
Elettrolitic Silver
Grafite

   

 

 

MULTILAYER WITH STANDARD HOLES

MULTILAYER WITH BLIND VIA HOLES
MULTILAYER WITH BURIED VIA HOLES

 Products
 Technologies

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Double Side

Multilayer

Back-Panel

Flex & Rigid Flex

Alluminium PCB

Technical Specification