Telecommunication-circuits normally have a multi-layers structure and holes with really strict dimensional tollerances, owed to PRESS-FIT component.

Materials:	FR4
Laminate Thickness:	0,5 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm
Copper Base Thickness:	18 - 35 µm
Surface Finishing :	Stagnatura Chimica Sn/PbSurfuso OSP HAL Chemical Gold Electrolitic Gold Electrolitic Nickel Elettrolitic Silver Grafite

 

PRESS-FIT TOLLERANCE TECHNOLOGY