Alluminium PCB
Printed circuits builded exploiting a new tecnology were used to solve heat dissipation problems with no external squanderer. Materials: Alluminium+Copper Laminate Thickness: 0,5 - 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm Copper Base Thickness: 18 - 35 - 70µm Surface Finishing : OSP HAL Chemical Gold Electrolitic Nickel Elettrolitic Silver Grafite
Printed circuits builded exploiting a new tecnology were used to solve heat dissipation problems with no external squanderer.
Materials:
Laminate Thickness:
Copper Base Thickness:
Surface Finishing :
OSP HAL Chemical Gold Electrolitic Nickel Elettrolitic Silver Grafite
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Double Side Multilayer Back-Panel Flex & Rigid Flex Alluminium PCB Technical Specification